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org 에서 이용 가능하다
orgで入手可能となる。初版は1999年6月発行。前版は2013年4月発行。
binary Data Matrix symbology for front-surface marking of metal lead-frame strips (also called ‘strips’)
SEMI M40-1109 (technical revision)
G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title No refunds providedThis document is a guideline for the ordering of tooling required to mold and form plastic molded small outline semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end of line toolmakers as the basis for defining the limits of manufacturing tolerances. Referenced SEMI Standards None.
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