Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage Ingestion-build-224916 not for material removal

not for material removal

This British Standard specifies requirements for and provides recommendations on the design

the provision of a working platform

and requirements for the assemblies themselves

and of reconnecting the safety lights to the normal source when this source is restored

Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage Ingestion-build-224916 not for material removal1 Scope This part of IEC 60191 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine pitch Ball Grid Array (FBGA), and Fine pitch Land Grid Array (FLGA).