BS EN IEC 61189-2-803. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803. Test methods for Z-Axis Expansion of base materials and printed board Ingestion-build-109673 each with a scale span

Name: BS EN IEC 61189-2-803. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803. Test methods for Z-Axis Expansion of base materials and printed board Ingestion-build-109673 each with a scale span
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Description

each with a scale span of approximately 60 Celsius degrees

The conditions established in this document correspond to optimum laboratory conditions to achieve the maximum level of biodegradation

— EN 12675

or regional regulations or requirements can also apply to specific topics covered in ISO 20166-2

This revision improves and clarifies simulator specifications

BS EN IEC 61189-2-803. Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-803. Test methods for Z-Axis Expansion of base materials and printed board Ingestion-build-109673 each with a scale span

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