PV09200 - SEMI PV92 - Test Method for Extension of Flexible Thin Film Photovoltaic (PV) Modules StdPbc-0118 Wafers to be tested may

Wafers to be tested may have one or more fiducial flats provided they are located in such a way that the wafer can be centered on the support pedestals (see ¶ 7

SEMI M70 — Test Method for Determining Wafer-Near-Edge Geometry Using Partial Wafer Site Flatness

本仕様は， CMOS大規模集積回路（LSI： large scale integrated circuit）デバイス用の薄膜シリコン・オン・インシュレーター（SOI： silicon-on-insulator）ウェーハの要求条件を規定するものである。本仕様は，130nm技術ノード以降（65nm，45nm等）のLSI用200mmおよび300mmウェーハを対象としている。150mmウェーハの場合には，旧来のLSI世代も含まれる。パラメータ，検査手順および受入基準を規定することにより，サプライヤと顧客双方が，製品の特性および品質要求条件を一貫して定義するのがよい。

This Document accomplishes this by defining an operational model for AMHS SEM equipment as viewed by a factory automation controller (Host)

1 to 1 ppm when the sample is diluted one to four

PV09200 - SEMI PV92 - Test Method for Extension of Flexible Thin Film Photovoltaic (PV) Modules StdPbc-0118 Wafers to be tested mayThis Standard provides a test method to assess extension performance of flexible thin film photovoltaic (PV) module. This Standard specifies apparatus, specimens, test procedures, requirements and test report of tensile test for flexible thin film PV modules. This Standard is applicable only for flexible thin film PV modules. Referenced SEMI Standards None.