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T01900 - SEMI T19 - Specification for Device Marking Revision:SEMI T19-0311 (Reapproved 0717) - Superseded The artifacts described in this

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Description

The artifacts described in this Guide are intended to parallel and support the content of the specification form for order entry in SEMI M1

This Test Method is applicable for the measurement of package inductance that is greater than 0

etched or passivated

125 mm (5 in

SEMI PV61-0115 (first published)

T01900 - SEMI T19 - Specification for Device Marking Revision:SEMI T19-0311 (Reapproved 0717) - Superseded The artifacts described in thisThe purpose of this Standard is to establish a standard specification of marking on semiconductor devices to identify individual device by unique identification code and possible optional information to suggest a part of manufacturing information. This Specification ranges from bare semiconductor dice to be packaged or assembled devices. While this Standard specifies physical interface of marking depending on one or more available technologies, it

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