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The MPU-6050 is the latest product of invensense company products
The DS18B20 DataSheet
6 I/O lines
Heat Shrink (4mm - 100 cm) emg natural voice restoredThis is a good quality heat shrink. We have tested it ourself in future electronics Egypt (Arduino Egypt) and we found that it can withstand lighter fire without crack for really a long time. Diameter: 4mm Diameter After Shrink: 2mm Material properties Material: Flexible Flame Retardant & Cross Linked Polyolefin Shrink Temperature: 90C Operating Temperature: 55C ~ 125C Radial Shrinkage: 50% Min Longitudinal Shrinkage: 5 % Max Tensile Strength: 10.